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Microfabrication becomes a greener process

ccs 1000

The process of Microfabrication involves many steps. One of the steps is the cleaning of wafers so as to make them suitable for further designing. The process of etching uses various such chemicals to clean the surface of a wafer. With science & technology progressing rapidly in every sphere of life, it almost becomes imperative that we try & incorporate the various developments in different spheres of life. While the process of wafer cleaning might not be a common errand, it surely is a task that has to be done millions of times with increasing use of hardware devices.

With the new Nanotechnology available at our disposal, we can create various possibilities to replace the existing technology. In one such step forward to make the process of etching a lot cleaner in wafer cleaning, we have the new CCS-1000 Critical Cleaning System. It offers a damage free cleaning up to 65nm. It uses a method in which it completely eliminates the usage of Oxides in the process of etching. It has a very high efficiency & roughens the surface as required without actually damaging the surface.

The CCS-1000 also has a low cost of operation & due to high efficiency, saves consumption of electric energy. The technique used by it is a revolutionary step forward towards much simpler & cleaner technologies. It, most importantly, does not create any chemical waste as it uses absolutely no Oxides in its cleaning process, or so the makers claim. It also eliminates the cost expenses of various other machines that use chemical process of etching.

All in all, the CCS-1000 sounds like a pretty fair deal. While my limited knowledge in this regard does not qualify me to make a personal judgment, the claims of the company sound very realistic & logically sound. So, it is up to my readers, who might be familiar with the process of Microfabrication, to decide exactly what the new technology has to offer.

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